A plastic film specified for electronics shipping should be approved against the actual contact surface, the role it plays in the ESD packaging system, and the condition expected at final removal. This guide applies to display modules, touch panels, HMI assemblies, printed overlays, coated housings, and other finished electronic products exposed to handling, storage, road, air, or sea transport. The main risks are scratching, trapped contamination, edge lift, film movement, charge generation, adhesive transfer, haze, coating disturbance, and difficult removal after extended dwell. Approval should therefore combine surface identification, packaging review, staged sample testing, transport simulation, and post-removal inspection rather than relying on one datasheet value.
Plastic films for flooring industry applications should be selected around the actual finish and process stage, not simply because a surface is called hard flooring. Laminate, embossed SPC or LVT, ceramic tile, and sealed stone can react differently to temporary adhesive contact. This solution covers production, handling, transport, installation, and planned removal. Key risks include scratches, trapped contamination, edge lift, film movement, adhesive transfer, haze, and surface change. Selection should consider texture, coating condition, dwell time, environment, traffic, removal timing, and actual trial results.
Conventional PET and BOPET films commonly show a polyester film melting temperature of about 245-260 C by DSC. The reported onset, peak, or endset varies with grade, orientation, thermal history, and scan conditions. Use it for base-film identification, not as a finished-film service limit. Confirm adhesive, coating, surface, dwell, and removal behavior under intended conditions.
